http://www.toshiba-components.com/ Toshiba ASIC and Foundry News en-gb Copyright: (C) Toshiba Electronics Europe GmbH 2009 23.05.2013 17:24:24 http://www.toshiba-components.com/images/logo_l.gif http://www.toshiba-components.com/ http://www.toshiba-components.com/ASIC/data/Toshiba_ASIC&Foundry_RFCMOS_M&T_april2009.pdf Article reprint (pdf 2415KB) - April 2009 Interview in German magazine Markt&Technik http://www.toshiba-components.com/ASIC/data/Toshiba_ASIC&Foundry_RFCMOS_M&T_april2009.pdf Press Release 17.04.2009 http://www.toshiba-components.com/prpdf/5881E.pdf Hybrid ASIC/COT flow optimises use of development resources http://www.toshiba-components.com/prpdf/5881E.pdf Press Release 21.04.2009 18:59:00 http://www.date-conference.com/conference/date09-wednesday-exhth Mr. Rainer Kaese, Senior Manager, ASIC & Foundry Biz Development, Toshiba Electronics Europe - Discussion Panel: Fabless semiconductor design at 65nm and beyond - At DATE 2009 (April) http://www.date-conference.com/conference/date09-wednesday-exhth Press Release 22.04.2009 http://www.toshiba-components.com/prpdf/5913E.pdf System LSI Division of Toshiba Semiconductor to present vision for future of the ASIC model http://www.toshiba-components.com/prpdf/5913E.pdf Press Release 27.04.2009 18:13:00 http://www.toshiba.co.jp/about/press/2009_04/pr2801.htm Toshiba, Nakaya and Amkor Sign Memorandum of Understanding on Forming a Joint Venture for System LSI Assembly and Test Service http://www.toshiba.co.jp/about/press/2009_04/pr2801.htm Press Release 28.04.2009 http://tv.theiet.org/technology/electronics/1300.cfm Tatsuo Noguchi (Technology Executive) Toshiba Corporation - Semiconductor Company, System LSI Div. - Are ASIC's Really on the Decline? The ASIC Model: Future Directions - At GSA & IET International Semiconductor Forum 2009 http://tv.theiet.org/technology/electronics/1300.cfm Press Release 03.05.2009 http://www.toshiba-components.com/ASIC/data/Toshiba_Hybrid_ASIC_M&T_june2009.pdf Article reprint (pdf 360KB) - June 2009 Interview in German magazine Markt&Technik http://www.toshiba-components.com/ASIC/data/Toshiba_Hybrid_ASIC_M&T_june2009.pdf Press Release 01.06.2009 http://www.toshiba-components.com/ASIC/data/Toshiba_ASIC_vs_FPGA_EJ_june2009.pdf Article reprint (pdf 443KB) - June 2009 Interview in German magazine elektronikJOURNAL http://www.toshiba-components.com/ASIC/data/Toshiba_ASIC_vs_FPGA_EJ_june2009.pdf Press Release 02.06.2009 http://www.toshiba.co.jp/about/press/2009_06/pr1501.htm Toshiba Develops a New High-k/Ge Gate Stack Technology for LSIs at 16 Nanometers (nm) Node and Beyond http://www.toshiba.co.jp/about/press/2009_06/pr1501.htm Press Release 15.06.2009 http://www.toshiba.co.jp/about/press/2009_06/pr1801.htm NEC Electronics and Toshiba Extend Chip Technology Development Agreements with IBM http://www.toshiba.co.jp/about/press/2009_06/pr1801.htm Press Release 18.06.2009 http://www.toshiba.co.jp/about/press/2009_06/pr1801.htm NEC Electronics and Toshiba Extend Chip Technology Development Agreements with IBM http://www.toshiba.co.jp/about/press/2009_06/pr1801.htm Press Release 18.06.2009 http://www.toshiba-components.com/prpdf/5919E.pdf Intellectual property supports rapid implementation of MIPI-compliant designs for mobile phones and associated devices http://www.toshiba-components.com/prpdf/5919E.pdf Press Release 01.07.2009 11:55:00 http://blog.epn-online.com Toshiba has been outlining its new strategy to halt the decline in the traditional ASIC market by offering a foundry service that incorporates some features of ASIC design. Interview with Eugen Pfumfel at the Wireless 2.0 event available from blog.epn-online.com http://blog.epn-online.com Press Release 09.07.2009 http://www.toshiba-components.com/prpdf/5920E.pdf Silicon-proven PHY for 40nm, 65nm, 90nm and 130nm processes http://www.toshiba-components.com/prpdf/5920E.pdf Press Release 24.07.2009 13:03:00 http://www.toshiba-components.com/ASIC/Documents.html Toshibas European LSI Design and Engineering Centre (ELDEC) was founded as a strong and sustainable contributor to the ongoing semiconductor operations of Toshiba Electronics Europe GmbH (TEE). ELDECs mission is to meet the needs of European customers and proactively address market requirements through the development and delivery of innovative, high-quality, silicon products with minimum time-to-market. More information about ELDEC could be found inside the Flyer (PDF). http://www.toshiba-components.com/ASIC/Documents.html Press Release 31.08.2009 http://www.toshiba.co.jp/about/press/2009_09/pr1601.htm Nakaya, Amkor and Toshiba Provide Update on System LSI assembly and testing service Joint Venture http://www.toshiba.co.jp/about/press/2009_09/pr1601.htm Press Release 16.09.2009 http://www.toshiba.co.jp/about/press/2009_10/pr2303.htm Nakaya Microdevices Corporation (NMD), Amkor Technology, Inc. (Nasdaq: AMKR) and Toshiba Corporation (TOKYO: 6502) today announced that they have signed definitive agreements for the formation of a joint venture to provide semiconductor assembly and final testing services in Japan. ... http://www.toshiba.co.jp/about/press/2009_10/pr2303.htm Press Release 23.10.2009 http://www.toshiba-components.com/ASIC/ASICNewsEvents.asp Read an extract of the GSA and IET International Semiconductor Forum keynotes review by The IET. http://www.toshiba-components.com/ASIC/ASICNewsEvents.asp Press Release 27.10.2009