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No. 6347 17.05.2013 |
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| Toshiba Launches SiC Hybrid Power Module for High Power Switching, Inverter and Motor Control Applications |
| 1700V/1200A IEGT with integrated SiC diode helps designers to improve system efficiency while reducing equipment size by as much as 40% |
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No. 6341 15.05.2013 |
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| Toshiba's Announces Miniature 30V MOSFETs with Industry-Leading RDS(ON) |
| New 30V lineup with ON resistance down to just 0.77mO also offers excellent RDS(ON)*Ciss figure of merit |
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No. 6330 15.05.2013 |
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| Toshiba’s Latest Photocouplers are Optimised for
RS-232 and RS-232C Communications |
| Devices in ultra-miniature S06 package suit industrial and home automation applications and can be driven at low 1mA input current |
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No. 6334 14.05.2013 |
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| Toshiba's Latest 600V Super Junction MOSFETs Combine Leading RDS(ON)•A Characteristics with Integrated High-Speed Diodes |
| 4th generation DTMOS IV devices with reduced recovery times improve efficiency and reduce size of switching power supplies |
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No. 6272 02.05.2013 |
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| Toshiba Electronics Launches Ultra-Miniature 1.0A Load Switch ICs |
| Wide input devices with slew rate control and built-in protection help to improve power management designs with minimum board space demand |
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No. 6269 18.04.2013 |
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| New Toshiba Stepping Motor Control Drivers Combine High Voltage,High Current and High Efficiency |
| Highly integrated motor control drivers in compact footprint based on BiCD 130nm process |
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No. 6324 16.04.2013 |
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| Toshiba Launches 8 Megapixel 1.12µm CMOS Image Sensor for Mobile Devices |
| Sensor with high dynamic range (HDR) function and VCM driver enables smaller, thinner camera modules for mobile devices |
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No. 6326 11.04.2013 |
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| Toshiba Starts Volume Production of SiC Power Devices |
| Silicon carbide lineup will meet demand for industrial and automotive applications |
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No. 6329 09.04.2013 |
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| Toshiba to Launch Full-HD, 1.12µm CMOS Image Sensor with Colour Noise Reduction |
| New sensor supports thinner smartphones and tablets |
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No. 6323 02.04.2013 |
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| Toshiba Announces Thinnest Camera Module with High Resolution, 13MP Image Sensor |
| CMOS image sensor camera module saves space in mobile devices |
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No. 6296 31.03.2013 |
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| Toshiba Extends Family of Extended Temperature, Low Current Drive, High-Speed Photocouplers* |
| Latest DIP8 couplers deliver 5Mbps operation, 5kV isolation at up to 125°C |
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No. 6320 19.03.2013 |
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| Toshiba TransferJet™ Close Proximity Wireless Transfer Technology to be Deployed with Antix Game Service |
| Service enhances user experience and extends monetization potential for content owners and distributors |
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No. 6266 18.03.2013 |
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| Toshiba’s Full HD CMOS Image Sensor Delivers High-Resolution Images to Security/Surveillance and Automotive Designs |
| 1080p sensor offers industry-leading dynamic range and fast frame rates for optimum viewing in high-contrast light conditions |
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No. 6263 15.03.2013 |
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| Toshiba’s Latest Generation of Automotive MOSFETs Lower RDS(ON) by 22%
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| 40V, 100A MOSFET for motion control applications is first to combine UMOS8 trench process with high-performance DPAK+ packaging |
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No. 6308 11.03.2013 |
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| Toshiba Announces Availability of Structured ASICs for European Customers |
| FPGA alternative with advantages for cost, power, and short time-to-market |
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No. 6310 04.03.2013 |
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| Toshiba Launches New Line-Up of Image Recognition Processors for Automotive Applications |
| Latest Visconti™ series enhances image recognition performance and simplifies vehicle system integration |
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No. 6316 26.02.2013 |
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| Toshiba to Launch microSDHC Memory Card for HD Content Viewing |
| Based on next-generation secure memory technology |
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No. 6300 26.02.2013 |
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| Starter Kit For Toshiba ARM Cortex™-M0 Microcontrollers Speeds Embedded Design of Smart Metering and High-Precision Measurement Applications |
| IAR KickStart Kit™ provides hardware and software for rapid evaluation, prototyping and testing of designs based on MCU with integrated power calculation engine and ?S ADCs |
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No. 6261 26.02.2013 |
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| Toshiba Launches ARM Cortex™ Development Board for Rapid Implementation of BLDC Motor Control |
| Low-cost, pre-configured board can be starter kit, reference design or standalone field-orientated control system |
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No. 6314 21.02.2013 |
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| Toshiba to Display Industry’s First microUSB Adaptor Supporting TransferJet™ Wireless Proximity Transfer Technology at MWC 2013 |
| Toshiba will display the industry’s first microUSB adaptor module compliant with the TransferJet™ at this year’s Mobile World Congress. |
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No. 6249 19.02.2013 |
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| Toshiba Announces First ARM Cortex™-M4 Microcontrollers |
| High-speed micros with DSP extensions, FPU and parallel processing deliver ultra-low-power digital processing |
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No. 6309 13.02.2013 |
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| Toshiba Ships Samples of Industry’s First Universal Flash Storage Devices |
| JEDEC UFS Ver.1.1 standard compliant embedded memories combine up to 64GB NAND and controller in single package |
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No. 6295 12.02.2013 |
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| IGBT/MOSFET Gate Drive Coupler from Toshiba Saves Power and Reduces Mounting Area by 50% |
| New device in advanced S06 package with 3.75kV isolation offers ±2.5A peak output current |
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No. 6259 06.02.2013 |
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| Toshiba Launches First 2.0A USB-Ready Li-ion battery Charger IC for Fast Charging Portable Devices |
| Mixed-signal 0.13µm IC optimises performance and form factor efficiencies |
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No. 6196 29.01.2013 |
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| Toshiba Electronics Launches Ultra-Miniature LDO Series with advanced Drop-Out and Noise Performance |
| Devices in 0.8mm x 0.8mm package meet power, space and performance requirements of battery-powered, portable devices |
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No. 6294 14.01.2013 |
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| Toshiba’s DIP8 Photocoupler Delivers Enhanced Isolation for IPM Motor Control in High-Noise, High-Temperature Environments |
| Low-Power device with 5kVrms isolation and wide input and output voltage ranges is ideal for signal isolation in IPM drives |
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No. 6235 07.01.2013 |
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| Toshiba Launches Compact DIP4 Photorelays with 5000V Isolation |
| New line-up with low trigger current can replace mechanical devices in applications requiring reinforced isolation |
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No. 6291 04.01.2013 |
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| Toshiba Launches Industry’s First microUSB Adaptor Module Compliant with the TransferJet™ Close Proximity Wireless Transfer Standard |
| Application for Android™ smartphones and tablets |
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No. 6292 03.01.2013 |
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| New Toshiba Audio Codec Integrates Single Microphone Noise/Echo Cancellation Technologies Creating Pure Voice Quality on Mobile Devices
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| Highly integrated audio codec rivals two microphone noise/echo cancellation solutions, simplifies design and lowers system development costs |
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No. 6276 18.12.2012 |
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| Toshiba to Launch CompactFlash® Memory Card for DSLR Market |
| World’s fastest class of CF memory card for high-end DSLR features Toshiba NAND flash technology |
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No. 6287 17.12.2012 |
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Toshiba to Showcase Latest Embedded Motor Control Devices and Tools Alongside Micros for Smart Metering
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| New microcontrollers, software and Starter Kits will speed implementation of industrial and home appliance motion control and smart grid applications
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No. 6288 14.12.2012 |
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| Toshiba to Start Sales of White LED Packages |
| New product to use GaN chips manufactured on 200mm silicon wafers |
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No. 6220 11.12.2012 |
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| Toshiba Launches High-Current Output Chipset for Free Positioning Wireless Charging |
| New chipset with two-coil transmitter offers WPC Qi™ technology and design efficiencies allowing mobile product placement anywhere on the battery charging pad |
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No. 6257 04.12.2012 |
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| Toshiba Announces CMOS Image Sensor Technology for Automotive and Surveillance Applications |
| Device with embedded High Dynamic Range (HDR) algorithm captures high-quality images in low light and high contrast ‘dark-to-light’ environments |
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No. 6258 28.11.2012 |
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| Toshiba Announces 13 Mega Pixel, 1.12 Micrometre, Cmos Image Sensor With Colour Noise Reduction That Improves Image Quality
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| New CMOS image sensor created with on-circuit colour noise reduction lowers pixel noise and improves image quality on smartphones, mobile devices |
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No. 6225 22.11.2012 |
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| Toshiba Introduces SHE-Compliant Security Module for Protecting Automotive Electronics |
| Toshiba Electronics Europe (TEE) has revealed a new security module for automotive microcontrollers, which meets advanced industry standards aimed at protecting vehicle electronics against hacking, tampering and software IP theft. |
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No. 6255 19.11.2012 |
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| Toshiba’s 6th Generation 600V IGBTs Improve Hard Switching Efficiency |
| Compact 15A, 20A, 30A and 50A devices with integrated diode suit motor drive, inverter and UPS designs |
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No. 6254 08.11.2012 |
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| Toshiba Launches Li-ion Battery Monitor Chipset for Automotive Applications |
| Monitoring IC and optimised microcontroller support up to 16 cells per IC in electric and hybrid electric vehicles |
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No. 6234 26.10.2012 |
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| Toshiba's New Photocouplers and Photorelays Publication is an Essential Reference for Optical Isolation |
| Over 80 pages of information to speed up designs requiring galvanic isolations |
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No. 6233 15.10.2012 |
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| Quad-Channel Transistor-Output Photocouplers in Small and Thin Packages |
| Compact devices with guaranteed operation from -55°C to 110°C suit PLCs, industrial inverters and servo amplifiers |
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No. 6228 03.10.2012 |
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| Toshiba’s Latest High-Speed, Low-Power ARM Cortex™-M3 Microcontroller Simplifies USB Designs |
| Micro for digital consumer and industrial applications offers integrated USB controller, high-performance ADC and configurable serial interfaces |
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No. 6250 01.10.2012 |
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| Toshiba Expands TransferJet™ Offering with Three New ‘Industry Firsts’ to Simplify Implementation of Close Proximity Wireless Transfer |
| Ultra-compact SDIO IC module, microSDIO card and USB adaptor drive adoption of TransferJet standard |
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No. 6171 26.09.2012 |
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| Toshiba Simplifies Display Integration for Next-Generation Handhelds |
| TC358768 parallel-to-DSI bridge simplifies upgrading of displays in devices |
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No. 6104 21.09.2012 |
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| Toshiba Launches new high performance LGA Package for Low RDS(ON) MOSFET family |
| P- and N-channel line-up ideal for power management and wireless charging designs |
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No. 6232 13.09.2012 |
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| Toshiba’s High-Speed DIP8 Photocoupler Delivers 15Mbps at up to 125°C |
| Logic IC coupler for industrial applications reduces power consumption and is compliant with the reinforced insulation class of international safety standards |
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No. 6231 12.09.2012 |
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| Industry-Leading 1800V RC-IGBT with Monolithic Integrated Diode |
| Integrated, high-temperature device minimises component count while meeting performance demands of latest voltage resonator inverter switching designs |
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No. 6223 10.09.2012 |
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| Toshiba Offers European Customers Flexible CMOS Process Development and Foundry Service |
| Access to established, cost-effective 8” wafer fabrication capability supports 0.6µm to 90nm process technologies and ensures long-term supply for medium- to high-volume applications |
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No. 6246 05.09.2012 |
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| Toshiba Launches New Line-up of MOSFETs and Schottky Diodes for Wireless Power Transfer Applications |
| Schottky barrier diodes and dual N-Channel MOSFETs achieve industry’s highest performance in a 2mm package |
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No. 6238 31.08.2012 |
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| Toshiba Expands High-Performance Memory Card Family with First microSD EXCERIA™ Products |
| 8GB to 32GB UHS-I-compliant card family supports latest portable storage and speed demands |
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No. 6240 29.08.2012 |
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| Toshiba Expands CMOS Image Sensor Offering with Low-Power, High-Performance Devices Driving Advanced Camera Features in Phones, Tablets and Notebooks |
| 720p and 1080p HD format FSI image sensors round out Toshiba’s industry-leading product portfolio |
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