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No. 581117.06.2008
Digital high speed photocoupler in miniature package
Device provides high speed isolated switching in logic systems, plasma display panels and factory automation interfaces
No. 581210.06.2008
Motor driver IC offers high resolution micro-stepping for high current applications
Driver delivers low vibration, high performance forward and reverse control
No. 580727.05.2008
Motion control evaluation platform speeds development of BLDC motor applications
Platform provides complete sensorless sine wave motor control and driver solution for industrial, home appliance and automotive applications
No. 576720.05.2008
Toshiba’s latest low noise amplifier offers built-in bypass circuit in small and thin packages
Miniature MMIC is ideal for digital terrestrial and mobile TV tuners
No. 580214.05.2008
Toshiba SoC solutions support DS2 in developing low-cost powerline communications chipset for consumer market
SoC process technology, development platform and local engineering support combine to ensure rapid development of low-power 100Mbps chipset
No. 580402.04.2008
Toshiba begins mass production of MLC NAND Solid State Drives
128GB MLC NAND Drive is the Largest Capacity SSD to be Featured in a Notebook PC
No. 579528.03.2008
Converteam Group, a worldwide engineering company specialized in power conversion, and Toshiba Electronics Europe GmbH, are pleased to announce the signature, in Paris, of a Memorandum of Understanding (MoU) that will open a new era in long-standing
The MoU sets out to define the intentions of both parties for the years 2008-2010: - a worldwide and strategic supply chain agreement; - the investigation for technical cooperation on new products using the latest Trench technology to be implemented in the future variable speed drives.
No. 578325.03.2008
Gate drive optocoupler provides 50% space saving in applications requiring reinforced insulation to international safety standards
Shrink DIP device delivers 5kV isolation and 2.0A output from 6.8mm x 4.6mm x 3.7mm package
No. 578219.03.2008
Miniature photocoupler combines high switching speed with 3.3V low power operation
Device provides 3.75kV isolation and suits high speed logic systems and factory automation interfaces
No. 578710.03.2008
Ultra-high-density process combines high performance and low power for next generation SoC and SiP designs
65nm technology provides performance, memory, IP and support for advanced multimedia designs with minimum turn-around-time

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