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I/O Expander TC35890XBG, TC35892BG, TC35893XBG, TC35894XBG, TC35895

I/O Expander can easily expand the functions such as GPIOs, Keypads, LED controls and timers to the existing systems.

The IO Expander addresses some of the mechanical and electrical challenges that arise during the design of a modern high-end clam-shell or advanced feature phone.  By conception, typical Baseband or application LSI packages are kept at a minimum pin count.  Very often the pin multiplexers have to be incorporated into those LSI to compromise functionality or flexibility with respect to the cost. 

Moreover signals of the main processors must often be transported over a mechanical hinge to remote areas of the mobile phone. The number of wires being routed over these hinges should be minimised due to the mechanical properties of the hinge. Flexible IO Expander+ allows to overcome those limits. Its flexible expansion capabilities makes it particularly useful for entire platform roadmaps with different functional extensions for each member of the platform family.  Read more (pdf 679KB).

 

I/O Expander Concept

The I/O Expander allows extended I/O functions controlled via a simple and easy to integrate I2C interface linked to your host CPU.  It allows an easy realization of additional digital inputs and outputs, also for time critical input signals that can generate interrupts to the host.  It features intelligent control of keypads and of normal switches, it incorporates a variety of timer and PWM functions for LED or other digitally controlled peripherals.  All this enables manufacturers to quickly launch spin-off models and other variations of their hardware, if their host CPU cannot support those function anymore.

 

Application/Benefits:

  • Reduction of mechanical stress on hinges in clamp shell phones
    Flexible IO Expander+ reduces dramatically the number of wires over movable parts.
  • Full support of low power operation from a 32kHz signal clock
    Flexible IO Expander+ requires only a 32kHz clock signal for the full operation which can be generated internally or externally.  The current consumption of this LSI is highly optimized for the use in mobile phones.
  • I/O Expansion of baseband processors
    Baseband or application chip packages are often limited in the amount of balls for basic periphery.  Due to this limitation, required IO functionality might be missing.  Flexible IO Expander+ provides up to 24 general purpose Input/Output pins at the location, where needed.
  • Expand your mobile phone with up to 96 keys
    Flexible IO Expander+ provides the full flexibility to handle various keyboard configuration from 2x2 to 8x12.  Also single keys are supported.  The Keyboard module detects up to four simultaneous key presses and de-bouncing is done in hardware.  The LSI is able to detect key presses and releases.
  • PWM signal generation for LED and vibrator control
    Three independent versatile timers can be programmed to generate modulated PWM signals without interaction of the host processor during runtime.
  • Rotator wheel interface in TC35892XBG
    The rotator wheel state machine counts up or down rotations of an external rotator wheel.  The interface is able to handle rotator devices with three dedicated click positions.
  • Additional glue logic to the phone in TC35892XBG
    The additional configurable on chip glue logic allows to combine up to four input signals.
  • EMI reduction on wires through hinge.
    Flexible IO Expander+ can operate only from a 32kHz clock. No high speed clock is required for stand-by or operation mode.

 

Features

  • Low-power operation
  • I2C interface; Max. 8×12 key matrix; PWM timer; general-purpose I/O pins (GPIO)
  • Up to 24 general-purpose I/O pins
  • Read more... (211KB pdf)

 

General Specifications

General specifications table of TC35890XBG, TC35892BG, TC35893XBG,TC35894XBG, TC35895WBG

Part number TC35890XBG TC35892XBG TC35893XBG TC35894XBG NEW TC35895WBG
Features Up to 24 GPIO pins;
crystal oscillation; support for dual power supplies
Up to 24 GPIO pins;
on-chip RC oscillation;
crystal oscillation
Up to 20 GPIO pins;
on-chip RC oscillation
Up to 24 GPIO pins;
on-chip RC oscillation;
Up to 20GPIO On-chip RC oscillator
Power Supply 1.7V ~ 3.6V 1.62V ~ 2.7V 1.62 ~ 3.6V 1.62 ~ 3.6V 1.62V ~ 3.6V
Package Dimensions 5mm × 5mm (36pins) 3.5mm × 3.5mm (36pins) 3.0mm × 3.0mm (25pins) 3.5mm × 3.5mm (36pins) 2.05mm*2.05mm*0.56mm CSP (36balls)
Package

 

Further Information

MPD (Mobile Peripheral Devices)

For more information please contact us.

   
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