Toshiba's SLC NAND supports customers' businesses with an extensive lineup of technologies
A recognized pioneer in flash technology, Toshiba developed NAND-type flash technology in 1984 and was the world leader in promoting its practical use. Toshiba continues to maintain its leadership in high density, advanced processes, and mass production technology. NAND flash memory was adopted in a variety of memory cards as well as consumer and industrial products, and the market expanded rapidly. NAND flash has become one of the leading technologies for solid state storage applications and is the de facto standard memory device for non-volatile storage.
SLC (single level cell) chips can read and write large amounts of data at high speed, supports high write/erase cycle endurance, and offer excellent reliability.
Toshiba developed the SLC devices to meet diverse embedded applications and its enhanced lineup of high-value added products offers support for mobile phones, flat panel TVs, office automation equipment, industrial storage, and SSD/servers, all of which require high read and write speeds and good reliability.
The line-up for SLC NAND ranges from mid-capacity models (those with a capacity of between 512 Mbits and 4 Gbits) to large capacity models (those with a capacity of 8 Gbits or more). For these SLC NAND products we provide support related to driver software, and technical assistance for developing NAND flash products.
BENAND removes the burden of ECC from the host processor while minimising protocol changes and allowing host processors to support leading edge process NAND flash memory in a timely manner. BENAND embeds an ECC with an error correction of 4 bit per 512 bytes onto Toshiba’s cutting edge 32nm process SLC NAND flash memory. Package and pin configuration compatibility are assured with general SLC NAND flash, allowing easy replacement of existing products.
SLC NAND Lineup
Features
- Full Wide Density Lineup:
512 Mb to16 Gb/Die
- Advanced NAND Flash Process Technology:
43 nm/32 nm process technology
- Power Supply: 3.3 V/1.8 V Product Lineups
- Multiple Package Options
TSOP/BGA/LGA and Stacked Die Technology
- Easy memory expansion. Both NAND standard Interface and High performance Toggle Mode Interface products available
- High Performance/High Reliability and Sustainable Long-Term Support
- Customer support
Simulation model (IBIS/Verilog) and Driver Support
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Applications

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