Advanced functions such as those that allow the playing and storing of still images, movies, and music data or the playing of games are increasingly being incorporated into mobile devices such as cell phones. To this end, there is a need to process large amounts of data faster. At the same time, there is increasing need for a multi-layer multi-chip package (MCP) because these functions must be mounted to a limited space in a package.
- Toshiba's MCP memory integrates large-capacity NAND flash memory, an e•MMC™ controller and low-power DDR2 memory in a single package.
Assembled using state-of-the-art 3D chip-stacking technology, the MCP memory is available in a small, thin MCP package.
- The integrated e•MMC™ controller allows fast read and write access to NAND flash memory.
Toshiba's MCP memory also incorporates low-power, high-speed LPDDR2 memory and helps improve the performance and reduce the power consumption of mobile devices such as smartphones.
The MCP memory allows mixing of RAMs and flash memories in various capacity points in a package with the same physical size.
As all MCP products are customised, please contact your Toshiba sales organisation for more information.
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