Advanced functions such as those that allow the playing and storing of still images, movies, and music data or the playing of games are increasingly being incorporated into mobile devices such as cell phones. To this end, there is a need to process large amounts of data faster. At the same time, there is increasing need for a multi-layer multi-chip package (MCP) because these functions must be mounted to a limited space in a package.

Features

• A wide range of combinations can be configured using our extensive line-up of memory LSI.
• Nine-layer stacked MCPs with a thickness of 1.4 mm (including spacers) and five-layer stacked MCPs with a thickness of 1.0 mm (including spacers) are being mass produced to take advantage of the latest MCP packaging technologies.

MCP Lineup

In addition to a RAM (DDR-RAM) and a Flash memory (NAND) of various capacities, a NAND Flash controller (e•MMC™) can be integrated in a single package.

As all MCP products are customised, please contact your Toshiba sales organisation for more information.

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