Toshiba to Start Sales of White LED Packages
Toshiba has announced that the company will start sales of white light-emitting diode (LED) packages that offer makers of general purpose and industrial LED lighting solutions a cost-competitive alternative to current LED packages. Mass production will start this month.
Production of LED chips is typically done on 2- to 4-inch wafers with an expensive sapphire substrate. Toshiba and Bridgelux, Inc. have developed a process for manufacturing gallium nitride LEDs on 200mm silicon wafers, which Toshiba has brought to a new production line at Kaga Toshiba Electronics Corporation, a discrete products manufacturing facility in northern Japan. Mass production of packages using the new line’s output starts this month.
Deployment of Toshiba and Bridgelux’s new gallium nitride-on-silicon (GaN-on-Si) technology to produce LED chips has allowed Toshiba to replace sapphire substrates and to produce the chips on a much more cost-competitive silicon substrate.
The low power consumption and long life of the white LED lighting is winning wide adoption in general purpose lighting, TV backlighting and other areas of application.
1.0-W-Class White LEDs for Lighting Applications
White LEDs for lighting applications: 1.0-W class
Test conditions: IF = 350 mA, Ta = 25°C
All values shown are typical values
Package
L × W (mm) |
Color Temp.
(K) |
Part Number |
Luminous Flux
Φv (lm) |
Chromaticity Coordinates |
Color Rendering
Ra |
Forward Voltage
VF (V) |
Viewing Angle
2θ1/2 |
| Cx |
Cy |
6.4×5.0 |
5000 |
TL1F1-NW0,L |
112 |
0.345 |
0.355 |
70min |
2.9 |
120 |
| 5000 |
TL1F1-NW1,L |
95 |
0.345 |
0.355 |
80min |
2.9 |
120 |
| 4000 |
TL1F1-WH1,L |
85 |
0.382 |
0.380 |
80min |
2.9 |
120 |
| 3000 |
TL1F1-LW1,L |
85 |
0.434 |
0.403 |
80min |
2.9 |
120 |
Further Information
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