Mobile World Congress 2012
27.2 - 1.3.2012 Barcelona, Spain

Visitors to this year's Mobile World Congress will be the first to see new demonstrations of Toshiba's high-resolution display solutions built around the Mobile Industry Processor Interface (MIPI®).
Among the demonstrations unveiled at Mobile World Congress will be support for the connection of high-resolution display panels to mobile devices using Toshiba’s new TC358766XBG integrated display serial interface (DSI)-to-DisplayPort bridge IC.
MWC will also be the premiere for demonstrations showing the future for display applications using MIPI UniProSM high-speed interface architecture and associated UniPort-M ports. Display interfaces that use UniPort-M allow for the support of large, high-resolution display panels while keeping power consumption to a minimum. Through these demonstrations Toshiba will show that the UniProSM interface can be used for applications beyond Universal Flash Storage (UFS) and cameras. Visit us on the MIPI booth in hall 7 G11.
MIPI® DSI to DisplayPort® TC358766XBG
Mobile Industry Processor Interface (MIPI®) Alliance

At Mobile World Congress this year, Toshiba is demonstrating the availability of the company's wireless LSI (part number TC35420) compliant with the TransferJet™ standard for close proximity wireless transfer technology. It will be shown together with other TransferJet™ consortiums member's system solution for ultra fast wireless data exchange applications on Tablets, MobilePhones, VideoKiosk or Digital Signage. Visit us on the TransferJet™ booth in hall 7 D22.
Toshiba's TransferJet™ Compliant IC
TransferJet™ Consortium
http://www.mobileworldcongress.com
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