The Toshiba Bluetooth 4.0 family of controller ICs supports new applications enabled by the introduction of Bluetooth Low Energy (LE), the key new feature of the Bluetooth 4.0 Core Specification, as well as "classic Bluetooth" applications in cars and personal computing. Bluetooth LE is intended for sharing small amounts of data among nodes in a wireless network with a minimum use of power, fast and easy connection set up. These applications may include activities such as a keyboard sending keystroke data, a wireless sensor reporting its latest sample set, a medical instrument reporting on a patient's status, a wireless biosensor sending an exercise machine the user's heart rate, a stuck valve in a factory sending an alert, and many other cases where a small amount of data needs to be exchanged. The standard is also widely adapted in latest smartphone generations under the BT SIG logo Bluetooth Smart or Bluetooth Smart Ready.
Toshiba Bluetooth IC Benefits
Toshiba's Bluetooth® ICs provide proven high connectivity, stability and interoperability. Various application scenarios can be created by using a) an HCI model with additional host CPU and ported Bluetooth stack/profile software, b) an integrated stack/profile concept with application on host MCUs, or c) a stand-alone configuration (no external host MCU) with bootable program code from external EEPROM.
The integration of nearly all the necessary RF and peripheral components lowers the bill of materials significantly and eases PCB design.
Toshiba's hardware and software have undergone qualified Bluetooth® tests and have proven it´s interoperability to hundreds of mobile solutions in the marketplace. Toshiba has tested the Bluetooth interoperability extensively and performed Bluetooth Qualification Body (BQB) qualification. The products are listed in the Bluetooth SIG qualified product list, which eases end product listing for system developers largely.
The integration of stack and profiles offers an all-in-one Bluetooth® system solution and is currently available with profiles such as SPP, HID, HSP or BLE GATT and combinations of those. Various application profiles (e.g. heart-rate, glucose-meter, battery service, find me etc.) according to BT LE standard are available, too.
Toshiba cooperates with partner companies to realize state-of-the-art ready-made module solutions for the industrial, medical or consumer market, which eases the adaption of this technology into systems and shortens Time-to-Market.
Toshiba Showcases it's dual-mode Bluetooth controller LSI
Bluetooth® Single-Chip Controller for BT Classic (3.0+EDR) and Bluetooth Low Energy (4.0) - The TC35661SBG is a highly integrated RFCMOS Bluetooth® device which supports Bluetooth® Classic (3.0+EDR) and the new BT LE (low energy) 4.0 standard. This product supports the standard Bluetooth HCI interface and offers integration of stack and selected BT profiles on-chip. Through its WIFI coexistence interface it supports the BT3.0-HS function in HCI mode. Support for Wide-Band-Speech (WBS) is available, too. The device realises an easy way to integrate Bluetooth® for various industrial, medical and automotive applications. Read more...
Bluetooth® Single-Chip Controller for Bluetooth Low Energy (4.0) - The TC35667FTG is a highly integrated RFCMOS Bluetooth device which supports the new BT Low Energy (LE) 4.0 standard. TC35667FTG is suitable for ultra low power portable products. The device comes with embedded BLE stack and GATT profile. Read more...
Get your design started
TC35661 Module˛ - Module˛ is a development module-on-module that combines a Bluetooth 4.0 module, a microcontroller and low power components. Measuring just 25mm by 17mm, the low power components make Module˛ especially suitable for battery driven applications. Read more...
Bluetooth Classic & LE starter kit - The BMSKTOPASM369BT(kc) starter kit makes it possible to quickly and easily evaluate Toshiba's Bluetooth® Dual Mode LSI TC35661-5xx in combination with Toshiba CortexM3 MCU as host MCU. Read more…
Bluetooth Module with TC35661 Bluetooth LSI available - The Toshiba Bluetooth® LSI TC35661SBG has been embedded - including it's SPP & BLE-GATT profile - into the Panasonic (PIDEU) module PAN1026. It is FCC/IC/CE certified. The embedded stack and profiles were Bluetooth™ SIG approved through extensive BQB (Bluetooth™ Qualification Body) tests. The module is ideal for wireless serial applications and all kind of BLE connectivity. System developers can make use of the Serial Port Profile and hook on their selected BLE profile onto BLE-GATT through the comfortable Toshiba API interface over UART. Read more... (pdf)
Bluetooth® USB Evaluation Board - Quickly and easily evaluate designs with the USB evaluation stick for TC35661SBG. Read more...
More kits to be announced soon...
For more information about Toshiba's Bluetooth® ICs please contact us.
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