Toshiba has released an Embedded SPP Application Note, read it here.
News: Bluetooth Module with TC35661 Bluetooth LSI available
The Toshiba Bluetooth® LSI TC35661SBG has been embedded - including it's SPP profile - into the Panasonic (PIDEU) module PAN1026. It is FCC/IC/CE certified. The embedded stack and profile were Bluetooth™ SIG approved through extensive BQB (Bluetooth™ Qualification Body) tests. The module is ideal for cable replacements. System developers can make use of the Serial Port Profile functionality through the comfortable Toshiba API interface over UART. Read more... (pdf)
Toshiba's Bluetooth® ICs provide proven high connectivity stability and interoperability, allowing various application scenarios by using an HCI model with additional host CPU and ported Bluetooth stack/profile software, or an integrated stack/profile concept .
The recent LSI TC35661SBG supports both the Bluetooth® classic standard up to BT3.0-EDR including a coexistence interface to WIFI solutions, and the new Bluetooth® Low Energy (LE) standard.
Toshiba's hardware and software have undergone qualified Bluetooth® tests and have proven it´s interoperability to hundreds of mobile solutions in the marketplace.
The integration of stack and profiles offers an all-in-one Bluetooth® system solution and is currently available with profiles such as SPP, HID, HDP or BLE GATT.
Toshiba can also provide access to state-of-the-art ready-made module solutions for the industrial, medical or consumer market, which eases the adaption of this technology into systems.
Toshiba Showcases it's dual-mode Bluetooth controller LSI
Bluetooth® Single-Chip Controller for BT Classic (3.0+EDR) and Bluetooth Low Energy (4.0)
The TC35661SBG is a highly integrated RFCMOS Bluetooth® device which supports Bluetooth® Classic (3.0+EDR) and the new Bluetooch Low Energy 4.0 standard. It can support the usual Bluetooth® HCI interface or offers integration of stack and selected BT profiles on chip. Through its WIFI coexistence interface it can support BT3.0-HS function. It realises an easy way to the Bluetooth® integration for manyfold industrial, medical and automotive applications. Toshiba has tested the Bluetooth interoperability extensively. All Toshiba Bluetooth® devices and software get BQB qualified.
Dual Mode core for legacy and new Bluetooth® standard
Proven interoperability of Bluetooth® hardware and software
Optional embedded on chip Bluetooth® stack and profile
Two layer PCB design feasable (@ 0.8mm ball pitch)
Minimal number of external components
Multiple IO options
On-chip voltage controller and low power modes
TC35661SBG HCI System Concept
The usual Bluetooth® HCI model (HCI: host controller interface): the low layer stack (RF, LC, LM) runs on the TC35661SBG device (ROM or external flash memory). Through a UART it is connected to an external host processor, which executes the upper Blueooth® stack (L2CAP, RFCOMM) and profiles. Beyond the upper stack the host processor runs the application software. Furthermore the application processor may run additional tasks such as middleware and multimedia functions. This concept works for voice and data.
TC35661SBG Embedded Profile System Concept
The Embedded Profile model incudes both lower and upper stack as well as some selected profile in the TC35661SBG (ROM or external flash memory). The UART interface carries the data of a higher layer API. All Bluetooth® functionaly is managed by the Bluetooth® LSI. The application processor only handles the data for the necessary application. Depending on the complexity of the application the host CPU performance requirement can be very minor. This concept is for data only.
Toshiba Embedded Profile Software Models
with Serial Port Profile (SPP) for wireless cable replacement
with Human Interface Device profile (HID) for remote control
with Generic Attribute (GATT) profile for BT 4.0 enabled accessory products
For more information about Toshiba's Bluetooth® ICs contact us.
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