Toshiba's Bluetooth® ICs provide proven high connectivity stability, allowing hands-free phone calling and audio playback capability by executing a variety of middleware on the integrated processor. This includes profiles such as SPP, HID, BLE GATT as well as HDP.
While Bluetooth® is becoming pervasive in mobile information devices, Bluetooth®-enabled automotive infotainment devices are getting more and more sophisticated. To meet the needs of Bluetooth®, Toshiba is gearing up the development of Bluetooth® chips.
Bluetooth Single-Chip Controller for BT Classic (3.0+EDR) and Bluetooth Low Energy (4.0)
The TC35661SBG is a highly integrated RFCMOS Bluetooth device which supports Bluetooth Classic (3.0+EDR) and the new Bluetooch Low Energy 4.0 standard. It can support the usual Bluetooth HCI interface or offers integration of stack and selected BT profiles on chip. Through its WIFI coexistence interface it can support BT3.0-HS function. It realises an easy way to the Bluetooth integration for manyfold industrial, medical and automotive applications. Toshiba has tested the Bluetooth interoperability extensively. All Toshiba Bluetooth devices and software get BQB qualified.
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Features
- Bluetooth Core Spec 3.0 and 4.0, EDR and LE support
- TC35661SBG-0X: HCI type
- TC35661SBG-1X: embedded profile type
- BT Class 2 support
- RF Sensitivity –91dBm typ.
- Baseband with ARM7TDMI - 13 to 52 MHz
- On-chip ROM, RAM, incl. Patch-RAM
- Alternative ROMless version available
- On-chip Balun, Antenna SW, LNA, LDO
- Interfaces: UART, SPI, USB2.0(FS), I2C, I2S/PCM, GPIO
- IEEE802.15.2. 2/3/4 coexistence interface
- Data Transfer up to 2 Mbps (DH5 packets) net
- Package: 64ball BGA (ROM version) - 0.5/0.8 mm pitch
- Package 121ball BGA (ROMless version) - 0.65mm pitch
- Operational Voltage: 1.8V or 3.3V (typ.)
- Low power sleep mode 30uA (max)
- Operation Mode <30mA (depends on packet-type and selected operational mode)
- AEC-Q100 automotive qualificaton (under development)
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Key Benefits
- Dual Mode core for legacy and new Bluetooth standard
- Proven interoperability of Bluetooth hardware and software
- Optional embedded on chip Bluetooth stack and profile
- Two layer PCB design feasable (@ 0.8mm ball pitch)
- Minimal number of external components
- Multiple IO options
- On-chip voltage controller and low power modes
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TC35661SBG HCI System Concept
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The usual Bluetooth HCI model (HCI: host controller interface): the low layer stack (RF, LC, LM) runs on the TC35661SBG device (ROM or external flash memory). Through a UART it is connected to an external host processor, which executes the upper Blueooth stack (L2CAP, RFCOMM) and profiles. Beyond the upper stack the host processor runs the application software. Furthermore the application processor may run additional tasks such as middleware and multimedia functions. This concept works for voice and data.
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TC35661SBG Embedded Profile System Concept
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The Embedded Profile model incudes both lower and upper stack as well as some selected profile in the TC35661SBG (ROM or external flash memory). The UART interface carries the data of a higher layer API. All Bluetooth functionaly is managed by the Bluetooth LSI.
The application processor only handles the data for the necessary application. Depending on the complexity of the application the host CPU performance requirement can be very minor. This concept is for data only.
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Toshiba Embedded Profile Software Models
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