PFBGAs and PTFBGAs are fine-pitch BGA packages with a solder ball pitch of 0.8 mm or less.  Toshiba’s PFBGAs and PTFBGAs are available in ball pitch ranges from 0.8 mm to 0.5 mm to support small form factor applications.  PFBGAs and PTFBGAs provide 1.4-mm and 1.2-mm maximum mounted height respectively, making them ideal for consumer electronics applications requiring low profile placement, such as mobile communications devices and portable devices, where I/O counts are in the range from 100 to 360.

PFBGAs have an array of solder bumps underneath the package with a pitch of 0.8 - 0.5 mm.  Wire bonding interconnect was used to keep cost low.  PFBGA is also considered as a KGD (Known Good Die) solution, providing test capability prior to assembly.
PTFBGAs are thinner BGA packages with a mounted height of 1.2 mm, versus 1.4 mm for PFBGAs.

Features:

• P-FBGA: 1.4 mm max. thickness, 0.80 mm ball pitch
• P-TFBGA: 1.2 mm max. thickness, 0.65 mm/0.50 mm ball pitch
• Ball count: up to ~ 400 balls
• Body Size: 5 x 5 - 18 x 18 mm²
• Cavity: cavity up
• Up to 1.5W power consumption
• Target application: consumer products

Benefits:

• Very cost competitive
• Suitable for application requiring very low height dimension

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