Toshiba European ASIC & Foundry Success Stories

• 12 October 2010 - Hyperstone selects Toshiba's ASIC technology, IP and services for development and manufacture of fabless semiconductor company’s nextgeneration ICs
  Hyperstone and Toshiba Electronics Europe (TEE) have signed development and manufacturing agreements that will see TEE provide a variety of ASIC design and manufacturing services to Hyperstone. Read more...
• 8 June 2010 - SPiDCOM chooses Toshiba ASIC and mixed-signal IP technology for dual-core HomePlug AV SoC
  90nm ASIC features 300MHz ARM processor and multimedia interfaces to provide integrated 'triple-play' solutions Read more...
• 21 April 2009 - Ubidyne chooses Toshiba for wireless infrastructure SoC development
  Hybrid ASIC/COT flow optimises use of development resources Read more...
• 21 January 2009 - IBS reports positive customer feedback for Toshiba’s ASIC and Foundry Services
  Customers recognise strengths in design, manufacturing and speciality IP  Read more...
• 13 November 2008 - Neotion receives fabless semiconductor supplier of year award
  Honour is bestowed at Elektra 08 Awards in Munich Read more...

Additional success stories...
• 18 August 2008 - Toshiba provides ASIC technology, design platform and local support for development of iDTV tailored ARM®-based MPEG-4 processor
  Neotion NP4+ decoder SoC delivered with minimum turn-around-time Read more...
• 21 July 2008 - Logipard chooses Toshiba SoC solution to develop advanced ASIC for MPEG-4 and H.264 video processing applications
  Process technology and local engineering support speed development of integrated ARM-based SoC for fabless semiconductor manufacturer  Read more...
• 14 May 2008 - Toshiba SoC solutions support DS2 in developing low-cost powerline communications chipset for consumer market
  SoC process technology, development platform and local engineering support combine to ensure rapid development of low-power 100Mbps chipset Read more...
• 5 February 2008 - Toshiba combines CMOS ASIC and eDRAM technologies to support rapid development of SIDSA mobile TV chipset
  Compact, low-power DVB-H IC demonstrates benefits of Toshiba model for fabless chip companies Read more...
• 8 October 2007 - Toshiba SoC technology and development platform are key to rapid development of DS2’s next-generation, high performance 200Mbps powerline communications chipset
  SoC design platform speeds time to market for latest IC from world-wide leading powerline communications specialist Read more...


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Toshiba European ASIC & Foundry Press Releases

• 26 January 2011 - Toshiba offers access to mature technologies and long-life process support for European ASIC customers
  Design and support options ideal for industrial SoC applications Read more...
• 24 February 2010 - RFCMOS ASIC platforms simplify implementation of advanced RF SoCs
  Technology and design flow support low-risk integration of RF, analogue and complex digital functionality Read more...
• 29 October 2009 - Toshiba expands European ASIC offering with eFUSE memory macro
  Electrically programmable fuse technology provides flexible solution for SoC integration Read more...
• 24 July 2009 - IP offers rapid, seamless integration of USB 2.0 functionality into advanced SoCs from 40nm
  Silicon-proven PHY for 40nm, 65nm, 90nm and 130nm processes  Read more...
• 1 July 2009 - Physical layer and protocols provide complete MIPI® IP solution for SoC development
  Intellectual property supports rapid implementation of MIPI-compliant designs for mobile phones and associated devices Read more...
• 27 April 2009 - Toshiba support for GSA & IET International Semiconductor Forum includes keynote address and access to ASIC and Foundry specialists
  System LSI Division of Toshiba Semiconductor to present vision for future of the ASIC model Read more...
• 9 March 2009 - Toshiba supports DATE with 'fabless' expert panel, technical papers and workshop session
  Toshiba represented at Date '09 by European ASIC & Foundry business, Telecommunication Research Laboratory and Corporate R&D Read more...
• 7 January 2009 - Mixed-signal IP cores provide rapid and seamless LVDS integration in SoCs for flat panel displays
  Advanced and flexible hard macros deliver silicon-proven LVDS transmit and receive functionality to FPDs Read more...

Additional press releases...
• 22 August 2008 - Toshiba’s ASIC & Foundry business joins fabless chip maker NEOTION for European Summit
  Companies to take part in discussion on evolution of video devices Read more...
• 29 July 2008 - Toshiba offers enhanced ARM® Cortex™ processor options to European ASIC and Foundry customers
  New licensing agreement plus local support delivers ARM Cortex-A9MP, Cortex-R4F, NEON® SIMD and PrimeCell peripheral options to European Custom CMOS SoCs Read more...
• 25 July 2008 - Toshiba announces co-design/co-verification platform for collaborative development of chip, package and PCB system
  New platform shortens SoC development times and delivers cost/performance-optimised solutions Read more...
• 10 March 2008 - Ultra-high-density process combines high performance and low power for next generation SoC and SiP designs
  65nm technology provides performance, memory, IP and support for advanced multimedia designs with minimum turn-around-time Read more...
• 30 January 2008 - Toshiba invites visitors to find out more about latest CMOS technologies, customised development services, local support and full-service supply chain management at DATE 2008.
  ASIC & Foundry business provides single solution for design, implementation, production and supply chain management of advanced ASICs, SoCs and SiPs Read more...
• 8 January 2008 - Toshiba licenses ARM Cortex™-M3 32-bit RISC processor for ASIC and ASSP applications
  Synthesisable processor core enables leading power efficiencies for advanced industrial and consumer CMOS SoCs Read more...


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Toshiba European ASIC & Foundry In The News

• Hybrid Biz-Model for ASIC & Foundry (pdf 31KB) July 2009 extract of GSA and IET International Semiconductor Forum keynotes review by The IET
  Reprint courtesy of The IET - http://kn.theiet.org/magazine/
• Toshiba has been outlining its new strategy to halt the decline in the traditional ASIC market by offering a foundry service that incorporates some features of ASIC design.  Interview with Eugen Pfumfel at the Wireless 2.0 event available from blog.epn-online.com
• FPGA vs. ASIC (pdf 443KB) June 2009 Interview in German magazine elektronikJOURNAL
  Reprint courtesy of elektronikJOURNAL- www.elektronikjournal.de
• Hybrid Biz-Model for ASIC & Foundry (pdf 360KB) June 2009 Interview in German magazine Markt&Technik
  Reprint courtesy of Markt&Technik - www.elektroniknet.de
• RFCMOS for ASIC & Foundry (pdf 2415KB) April 2009 Interview in German magazine Markt&Technik
  Reprint courtesy of Markt&Technik - www.elektroniknet.de
• Mixed-Signal SoC (pdf 625KB) March 2009 Article in English magazine New Elektronics (page 25-26)
  Reprint courtesy of New Elektronics - www.newelectronics.co.uk
• Mixed-Signal SoC (pdf 175KB) February 2009 Article in German magazine Elektronik Informationen (page 28-30)
  Reprint courtesy of Elektronik Informationen - www.elektronikinformationen.de

Additional news items...
• European ASIC Market (pdf 515KB) June 2008 Interview in German magazine Markt&Technik - Sonderheft Halbleiter
  Reprint courtesy of Markt&Technik - www.elektroniknet.de
• ASIC Supply Chain Management (pdf 470KB) June 2008 article in German magazine Elektronik Praxis (special edition) 9/2008 page 42
  Reprint courtesy of Elektronik Praxis - www.elektronikpraxis.vogel.de
• 65nm ASIC Technology (pdf 1088KB) July 2008 article in German magazine Elektronik 14/2008 page 27
  Reprint courtesy of Elektronik - www.elektroniknet.de
• 65nm ASIC Technology (pdf 1,875KB) March 2008 article in EPD
  Reprint courtesy of EPD - www.epdonthenet.net
• SIP Technology (pdf 548KB) February 2008 Interview in German magazine Markt&Technik
  Reprint courtesy of Markt&Technik - www.elektroniknet.de
• ASIC Technology (pdf 159KB) June 2007 Interview in German magazine Markt&Technik
  Reprint courtesy of Markt&Technik - www.elektroniknet.de
• Universal Array (pdf 148KB) April 2007 Interview in German magazine Markt&Technik
  Reprint courtesy of Markt&Technik - www.elektroniknet.de
• SoC Business Model (pdf 291KB) August 2006 Article in English magazine EPN
  Reprint courtesy of EPN - www.epn-online.com
• SoC Business Model (pdf 125KB) December 2006 Article in German magazine Elektronik Industrie
  Reprint courtesy of Elektronik Industrie - www.elektronik-industrie.de
• Structures ASIC / Array moved into a niche, but Universal Array continues (pdf 227KB) March 2006 Interview in German magazine Markt&Technik
  Reprint courtesy of Markt&Technik - www.elektroniknet.de


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Past European Speaking Events

• Tatsuo Noguchi (Technology Executive) Toshiba Corporation - Semiconductor Company, System LSI Div. - Are ASIC's Really on the Decline? The ASIC Model: Future Directions - At GSA & IET International Semiconductor Forum 2009 Read more...
  view the video stream recorded by IET.tv
• Mr. Rainer Kaese, Senior Manager, ASIC & Foundry Biz Development, Toshiba Electronics Europe - Discussion Panel: Fabless semiconductor design at 65nm and beyond - At DATE 2009 (April) Read more...
• Mr. Eugen Pfumfel, Principal Engineer, SoC Biz Development, Toshiba Electronics Europe - Discussion Panel: The Evolution of Video Devices - At Connections Europe 2008 (August) Read more...
• Dr Tohru Furuyama, General Manager, Centre for Semiconductor Research & Development (CSRD) - keynote at DATE 2007 in Nice / France  Read more... 
  view the video stream recorded by IET.tv
• Mr. Derpmann, General Manager, ASIC & SoC, Toshiba Electronics Europe - executive track at DATE 2006 in Munich / Germany  Read more...
  view the video stream recorded by IET.tv

Some of the most recent ASIC & Foundry press releases from Toshiba Japan

• Nakaya, Amkor and Toshiba Sign Definitive Agreements on Joint Venture for Semiconductor Assembly and Test Service
• Nakaya, Amkor and Toshiba Provide Update on System LSI assembly and testing service Joint Venture
• NEC Electronics and Toshiba Extend Chip Technology Development Agreements with IBM
• Toshiba Develops a New High-k/Ge Gate Stack Technology for LSIs at 16 Nanometers (nm) Node and Beyond
• Toshiba, Nakaya and Amkor Sign Memorandum of Understanding on Forming a Joint Venture for System LSI Assembly and Test Service
• Toshiba Develops World's Highest-Bandwidth, Highest Density Non-volatile RAM

Previous Years:
2008  2007  2006  2005  2004

2008

• Toshiba develops cost-effective 32nm CMOS platform technology by advanced single exposure lithography
• Toshiba Establishes New Platform Technology for 40nm CMOS Process
• Toshiba, IBM, and AMD Develop World’s Smallest FinFET SRAM Cell with High-k/Metal Gate
• Variability Aware Modelling for Design Layout to boost gate density
• Twisted Direct Silicon Bonding Technology
• Toshiba, Sony, and SCEI new JV Fab
• Fast 65nm eDRAM

Hide 2008

2007

• 32nm technology
• 32nm R&D collaboration with IBM
• 32nm at IEDM
• 32nm joint development with NEC
• SSRM technology Improve Cutting-Edge LSI

Hide 2007

2006

• Toshiba, Sony and NEC Electronics for 45nm
• Low Power eDRAM in 65nm
• 45nm Development  
• Foundry planning
• 32nm Development

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2005

• Xilinx 65nm foundry
• CDM Electrostatic Discharge
• 45nm Development
• Universal Array
• Low power SoC

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2004

• Xilinx 90nm/300mm wafer foundry
• 300mm wafer fab
• Multi chip package

Hide 2004

For a full selection of ASIC & Foundry press releases click here.  For press releases before October 2008 click here.

For Toshiba corporate press releases click here.

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