QFN (Quad Flat Non-leaded package) is based on a lead frame package. The terminals are located under the package body, which results in a smaller body size compared to QFP. So this package type is attractive for applications that require smaller/thinner body dimensions than available QFP.
Body size is relatively smaller than QFP, resulting in a much improved RLC level compared to QFP.
As shown in the cross section the die pad is exposed on the bottom side of package. A solder connection between PCB plane and exposed die pad will improve drastically the heat dissipation to the PCB, resulting in a lower thermal performance than seen for QFP or PFBGA packages.
- Pin Count: 36-124 pins
- Lead Pitch: 0.5mm/0.4mm or 0.65mm/0.5mm
- Package Height: 0.9mm max
- Body Size: 5.3-12mm sq
- Max Power Dissipation: ~1W @ TA=70C
- Target application: Consumer products
- Very cost competitive
- Suitable for application requiring very small dimensions
- Good thermal performance
Back to Top
Back to ASIC & Foundry Home