QFN (Quad Flat Non-leaded package) is based on a lead frame package.  The terminals are located under the package body, which results in a smaller body size compared to QFP. So this package type is attractive for applications that require smaller/thinner body dimensions than available QFP.

Electrical:
Body size is relatively smaller than QFP, resulting in a much improved RLC level compared to QFP.

Thermal:
As shown in the cross section the die pad is exposed on the bottom side of package.  A solder connection between PCB plane and exposed die pad will improve drastically the heat dissipation to the PCB, resulting in a lower thermal performance than seen for QFP or PFBGA packages.

Features:

• Pin Count: 36-124 pins
• Lead Pitch: 0.5mm/0.4mm or 0.65mm/0.5mm
• Package Height: 0.9mm max
• Body Size: 5.3-12mm sq
• Max Power Dissipation: ~1W @ TA=70C
• Target application: Consumer products

Benefits:

• Very cost competitive
• Suitable for application requiring very small dimensions
• Good thermal performance

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