Toshiba Foundry Services

Toshiba handles its own process development, and has its own, fully controlled wafer fabs, packaging and test facilities.

Toshiba continues to invest in technology and fab capacity to ensure reliable support of its customers’ requirements. ASIC and System LSI devices are manufactured in the company’s Iwate plant (mature technologies down to 0.35um CMOS) and Oita plant (0.25um … 45nm CMOS).

More information about the production flow is included in this video: Play video (mpg 40MB, we recommend to download via broadband internet only).

Toshiba has also developed close working links with a number of major 3rd party technology and assembly and test suppliers. This provides a high degree of flexibility (e.g. process option, schedule, urgent mass production introduction, recovery) to accommodate customer needs.

Toshiba is able to commercialize leading-edge CMOS processes for advanced ICs one to two years ahead of the industry, to the direct benefit of our 300mm manufacturing customers.  By leading the industry in producing high-performance system-level ICs in 90nm since 2003, plus early production of 65nm in 2006—with co-development of 45 and 32nm process technologies underway—Toshiba is able to stay ahead of the yield curve. We're continually solving DFM complexities to enhance performance, streamline time-to-revenue and reduce IC cost.

• Toshiba continuously investment in fabrication lines (45nm and beyond)
• Toshiba serves volume customers that lead their industries and require differentiated products
• Toshiba defect density is at least one year ahead of industry
• Toshiba is able to integrate low-power embedded DRAM
• Toshiba enables access to key IP, such as MIPS or ARM, ADC/DAC, PLL, SerDes, USB, SATA, ...
• Toshiba managed yield and introduces advanced DFM methodology
• Toshiba has fully characterized spice models and extraction data across all corners: drc/lrc/erc
• Toshiba offers complete product testing and logistics management
• Toshiba has flexible business model with seamless interface of 3rd party assembly, substrate or test