The Plastic Quad Flat Package represents one of the mainstay
packages for the ASIC industry. It can be manufactured in high
volumes and at low costs in lead counts ranging from 44 to 160.
PQFP body sizes may be rectangular or square, ranging from 10mm to
40mm on a side. Lead pitches are from 1.0mm to 0.5mm, exiting the
moulded package body on four sides in a gull wing configuration. With
modest thermal and electrical characteristics, PQFPs are meant to
address the low performance market segment.
Features:
- PQFP: Plastic Quad Flat Pack (maximum thickness 1.7mm)
- LQFP: Low Profile Quad Flat Pack (maximum thickness 1.4mm)
- TQFP: Thin Quad Flat Pack (maximum thickness 1.0mm)
- Competitive cost performance in low pin count area
- Pin count: 44 – 304 pins
- Body size: 7 x 7 - 40 x 40 mm˛
- Ball pitch: 1.00/0.80/0.65/0.50/0.40 mm
- Cavity: cavity up
- Lead frame package
- Up to 2W power consumption
Benefits:
- Best cost competitive package with good technical performance
Other packages can be offered on special request. As Toshiba
cooperates with the world’s largest package suppliers, the possible
package solutions are innumerable.
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