PFBGAs and PTFBGAs are fine-pitch BGA packages with a solder ball
pitch of 0.8 mm or less.
Toshiba’s PFBGAs and PTFBGAs are available in ball pitch ranges from
0.8 mm to 0.5 mm to support small form factor applications. PFBGAs
and PTFBGAs provide 1.4-mm and 1.2-mm maximum mounted height
respectively, making them ideal for consumer electronics
applications requiring low profile placement, such as mobile
communications devices and portable devices, where I/O counts are in
the range from 100 to 360.
PFBGAs have an array of solder bumps underneath the package with a
pitch of 0.8 - 0.5 mm. Wire bonding interconnect was used to keep
cost low. PFBGA is also considered as a KGD (Known Good Die)
solution, providing test capability prior to assembly.
PTFBGAs are thinner BGA packages with a mounted height of 1.2 mm,
versus 1.4 mm for PFBGAs.
Features:
- P-FBGA: 1.4 mm max. thickness, 0.80 mm ball pitch
- P-TFBGA: 1.2 mm max. thickness, 0.65 mm/0.50 mm ball pitch
- Ball count: up to ~ 400 balls
- Body Size: 5 x 5 - 18 x 18 mm˛
- Cavity: cavity up
- Up to 1.5W power consumption
- Target application: consumer products
Benefits:
- Very cost competitive
- Suitable for application requiring very low height dimension
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