PBGA packages are available with 256 to 1,000 pins to target
high-pin-count applications.
PBGAs can be mounted using standard surface mount equipment.
Compared to conventional packages such as QFPs, PBGAs offer reduced
skew and lead coplanarity assembly problems, leading to lower
surface mount defect rates. PBGAs are suitable for many ASIC
applications and are the most popular package in use today.
PBGA packages have a two- or four-layer substrate with power and
ground rings. Power/ground pads on the die are wire-bonded to the
power/ground rings on the package substrate. This helps to
reduce noise, making PBGAs well suited for high-speed designs.
Features:
- Improved thermal resistance with thermal balls added
- Ball count: 256 – 1000 balls
- Body size: 23 x 23 - 40 x 40 mm˛
- Ball pitch: 1.00 mm/1.27 mm
- Cavity: cavity up
- Substrate: 2 or 4 layers
- Up to 4W power consumption
Benefits:
- Best ratio in cost, electrical and thermal performance
- Particularly suitable where high speed interfaces are required
Back to top
Back to Packages Home
To Top